WIRE-BONDING probe and soldering station for microwave circuits

Description

• Probe station adapted to take measurements in terahertz wavebands, featuring
  a structuring laser system.
• • JBC soldering station with different terminals
• • Wire-bonding station
• • Probe station for on wafer measurements
• • Assembly and microwave circuit soldiering bench

Uses and applications

Development of radio-frequency subsystems that operate in microwave,
millimetre and terahertz wavebands.

Equipment classification

Demo units

Service code

A.4
F.8

Equipment code

N1.16

Associated services

• Advice on wireless technologies for Industry 4.0.
• Seminar on cutting-edge technologies for connectivity.

Photos